6101/1060 tin plated aluminum Busbar for Electrical use
Specification
1. Alloy No.: 1060/1070/6061/6101
2. Temper: H12, H14, T6
3. Thickness: 0.5mm-2mm
3. Width: 50-1000mm
4. Length: 1000-12000 mm
Thermal Capacity
The thermal storage capacity of aluminium is 0.214 cal/gram/C. For copper it is 0.092 cal/gram/C. Therefore aluminium has a thermal storage capacity of more than 2-3 times that of copper. This is used to advantage in wound transformers, as
aluminium can withstand more surge and overload currents.
Conductivity
When the density of copper (8.89 gm/cm) is compared to aluminium (2.91gm/cm) and taking into consideration the conductivity ratio of aluminium to copper of 57% for grade 6101 aluminium, aluminium has approximately 1.85 times that of copper. Copper has a greater conductivity on an equal volume, cross sectional area basis.
Mechanical Strength
Aluminium does have a lower tensile strength (37%) than copper for the same cross section of material. However, approximately 66% greater cross-section of grade 6101 aluminium is required to carry the same amount of current as would be required for a copper conductor, so the larger cross-section of aluminium approaches the tensile strength of copper for a given ampacity.
how to produce the tin plated aluminum Busbar?
The aluminum is very lively amphoteric metal, self-passivation ability, no proper activation, after plating, the plating adhesion is poor, shall have peeling phenomenon.
Tin plated aluminum Busbar, the best and first to take the zinc immersion (also known as depositing zinc), zinc deplating and then depositing zinc again, tin plating. This secondary depositing zinc technology can guarantee the quality of plating.
Tin plated aluminum Busbar (including electroless plating), is basically this kind of process, the first zinc immersion , zinc deplating, and then depositing zinc again, tin plating. There is also only one time of depositing zinc ,but the operation requirements are high, there is no certain ability, or honestly implement the secondary zinc process.